Products

Silicon ingot resin diamond grinding wheel

Silicon ingot resin diamond grinding wheel uses resin bond, high quality diamond abrasive, used for chamfering polycrystalline silicon block grinding surface. Common specifications 260 * 38 * 60 granularity 100-200 #, 250 * 38 * 60 600-1000 # suitable for Japanese BBS and other monocrystalline silicon polysilicon integrated machine.


Bold Group

Forturetools

Yucheng Diamond

BYD Abrasives

YuCheng

Malaysia
ADD: No.10 Dongqing Street,
High&New tech Development Zone.
Zhengzhou, Henan, China.
Postal code: 450001 E-mail:info@bold68.com
Phone: 0371-67662016 86162612
©Copyright 2004 Zhengzhou Bold Abrasives Co., Ltd. All Rights Reserved.
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